case:to-277 molded plastic "green" molding compound mmended pad layout . 2. fr-4 pcb, 2oz. copper, minimum reco excellent high temperature stability weight: 0.093 grams (approx.) lead free: for rohs/lead free version high thermal reliability ultra low power loss, high efficiency high foward surge capability maximum junction temperture 200oc bypass diodes for solar panels 10U45 feat ures ! ! ! ! m echanical data ! ! terminals: plated leads solderable per mil-std-202, method 208 ! polarity: cathode band ! ! mounting position: any ! marking: type number m aximum ratings and electrical characteristics @t a =2 5c unless otherwise specified single phase, half wave, 60hz, resistive or inductive load. for capacitive load, derate current by 20%. note: 1. valid provided that leads are kept at ambient temperature at a distance of 9.5mm from the case. ! patented super barrier rectifier technology ! ! ! 3. polymide pcb, 2oz. copper. cathode pad dimensions 18.8mm x 14.4mm. anode pad di mensions 5.6mm x 14.4mm. 10.0a schottky barrier rectifier 10U45 150 0.38 dimiensions inches and ? p l o l p h q w h u v ? t o-277 a l l d a t a s h e e t . c o m
10U45 10.0a schottky barrier rectifier the cruve g ra p h is for reference onl y , can't be the basis for j ud g ment ( ?4? ?o ?5 ) ! a l l d a t a s h e e t . c o m
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